What is a reflow profile?
Reflow soldering is a process by which the solder paste is heated and changes to a molten state in order to connect components pins and PCB pads together permanently. Reflow zone: The reflow zone, also referred to as the “time above liquidus” (TAL), is the part of the process where the highest temperature is reached.
What does reflow mean in soldering?
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.
How many times can you reflow a PCB?
There is no hard industry rule but the rule of thumb for most companies is no more than 5 to 6 thermal cycles at reflow.
What is the SMT process?
Electronics manufacturing using surface-mount technology (SMT) simply means that electronic components are assembled with automated machines that place components on the surface of a board (printed circuit board, PCB). When it comes to electronic assembly, SMT is the most frequently used process in the industry.
How is PWI calculated?
The PWI for a complete set of profile statistics is calculated as the worst case (highest number) in the set of statistics. For example: if you run a profile with three thermocouples and four profile statistics are logged for each thermocouple, then there will be a set of 12 statistics for that profile.
What is low temp solder?
It is commonly used for low temperature soldering with a melting point of +143°C (+289°F). In52/Sn48 is an indium alloy with added tin and a very low melting point. This eutectic alloy achieves a melting point at only +118°C (+244°F) and is excellent when working with very heat sensitive components that require low soldering temperatures.
What is soldering profile?
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.
What is flow soldering?
flow soldering. [′flō ‚säd·ə·riŋ] (engineering) Soldering of printed circuit boards by moving them over a flowing wave of molten solder in a solder bath; the process permits precise control of the depth of immersion in the molten solder and minimizes heating of the board. Also known as wave soldering.