What is a CMP process?
Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
What is CMP equipment?
What is CMP? Chemical mechanical planarization (or polishing) [CMP] is a critical step that is used multiple times in the semiconductor manufacturing process at each layer of the wafer to remove excess materials and create a smooth surface. This is done through the interaction of a pad and slurry on a polishing tool.
What is a CMP slurry?
Briefly, CMP slurries are heterogeneous dispersions comprised of micro-abrasive particles dispersed in a chemically active mobile phase. They are used in conjunction with lapping or rotary buffing equipment to remove small volumes of surface material from typically hard, crystalline workpieces.
What is the purpose of CMP process?
CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing.
What are the 2 ways to stop the CMP process?
Copper CMP typically requires at least two steps [19,125]. The first step is Cu removal, stopping on the barrier layer, and the second step is the barrier removal, stopping on the dielectric.
What is CMP in VLSI?
Chemical Mechanical Polishing or Planarization CMP is also a standard and critical manufacturing process practiced in the semiconductor industry to fabricate integrated circuits and memory disks. Similarly, if the process of CMP is used to smooth or flatten the surface, we refer to it as planarization.
Who invented CMP?
IBM
IBM invented CMP in the late 80’s to allow for more metal layers in the integrated circuits (IC) that they produced. Originally it was called Chemical Mechanical Planarization (CMP) since that was the purpose for which it was created.
Why CMP is used?
A comprehensive metabolic panel (CMP) is a blood test with 14 different measurements. It is often used to evaluate liver function, kidney function, and nutrient levels. Because it includes multiple measurements, the CMP offers a broad look at different functions of the body.
What is diamond slurry used for?
Diamond slurry/slurries is excellent for processing many different non-metal and metal components including mechanical seals, aircraft components, medical devices, valves and electronics.
What can CM process solutions do for You?
Whatever your requirements, large or small, CM Process Solutions can provide you our valued customer a dedicated team of engineers, sales and service associates the assistance you need from custom made equipment to standard products and solutions.
How is CMP used in the semiconductor industry?
The original commercial practice of CMP in the semiconductor industry was to prepare raw silicon wafers. After the wafer was sawed from a single-crystal silicon rod, the mechanically damaged surface layer was removed and the surface planarized to produce a flat, scratch-free surface for VLSI devices and circuits.
Why was CMP invented in the 80’s?
IBM invented CMP in the late 80’s to allow for more metal layers in the integrated circuits (IC) that they produced. Originally it was called Chemical Mechanical Planarization (CMP) since that was the purpose for which it was created. A typical transistor wiring process flow of the time is shown.
How is a polishing pad used in CMP?
Polishing pad – a polymer pad that the wafer is rubbed against during the CMP process. It is applied to the polishing table which rotates under the polishing arm. Slurry is dispensed on to the pad and the polishing arm pushes the carrier head against the pad to polish the wafer. Polishing pads are designed with a variety of properties and purposes.