What is chemical mechanical polishing process?
Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
What is chemical mechanical polishing used for?
Chemical mechanical polishing (CMP) is a final major manufacturing step extensively used in semiconductor fabrication for polishing semiconductor wafers or other substrates.
What is slurry polishing?
During the CMP process, a wafer surface is polished for planarization using a slurry and a polishing pad. The chemicals in the slurry then etch and dissolve the material. This process is designed to remove areas of elevated topography more quickly than the lower areas.
What is CMP in manufacturing?
Chemical mechanical planarization (or polishing) [CMP] is a critical step that is used multiple times in the semiconductor manufacturing process at each layer of the wafer to remove excess materials and create a smooth surface. This is done through the interaction of a pad and slurry on a polishing tool.
What is CMP slurry?
Chemical mechanical planarization (CMP) slurries are liquid dispersions containing active chemicals and microabrasive grains used for chemical mechanical planarization. CMP is a surface polishing and material removal process involving both chemical attack and abrasive removal.
Why is CMP necessary?
A comprehensive metabolic panel (CMP) is a test that measures 14 different substances in your blood. It provides important information about your body’s chemical balance and metabolism. Metabolism is the process of how the body uses food and energy.
How dishing can be avoided in chemical mechanical planarization?
The problems with dishing/erosion and cracking/adhesion loss can be minimized by reducing the downforce during CMP and improving the adhesion between layers in the stack [127].
What is chemical mechanical polishing in VLSI?
Chemical mechanical polishing is a polishing process assisted by chemical reactions to remove surface materials. CMP is also a standard and critical manufacturing process practiced in the semiconductor industry to fabricate integrated circuits and memory disks.
What is diamond slurry?
The conventional definition of slurry is a mixture of water and small particles of a solid. In NDP slurries, the particles are micron sized diamond particles and the liquid (carrier vehicle) can be oil or water based. Oil or emulsions are the most common.
What is wafer polishing?
Semiconductor wafer polishing, also referred to as Chemical Mechanical Polishing (CMP), removes this subsurface damage to create thinner and more flexible silicon wafers. Polishing also removes stresses and prevents warping that weakens wafers, giving you a stronger semiconductor wafer.
What are CMP polishing pads?
The Politex™ pad series for chemical mechanical planarization (CMP) is used for copper barrier, buffing and cleaning applications. Politex™ pads are the industry-standard soft pad.
What is CMP slurry made of?
CMP slurries typically consist of a nano-sized abrasive powder dispersed in a chemically reactive solution. While chemical etching softens the material, the mechanical abrasion removes the material, thus flattening the topographic features and making the surface planar.