Is SO8 same as soic8?
SO8, SO-8, SO08, SOIC-08 or similar package names may not refer to the same package. Wikipedia says there are two competing standards JEDEC and EIAJ. For each IC using such a package we should check the datasheet or even measure the device length/width itself. Probably we’ll have to introduce different packages.
What is SOP package in IC?
Small Out-Line Package IC Also refer to a PSOP, a plastic SOP, again a much smaller IC with fewer pins. The term Small-Outline normally just means that the package is thinner than a pre-existing package style. The term doesn’t define the type of leads or terminals used with the package.
What is the difference between TSSOP and SSOP?
SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package. TSSOP package having an encapsulant width less than 300mils covering entire package, having total height less than 1.2mm, said package named Thin Shrink Small Outline Package.
What does TSSOP stand for?
Thin-shrink small outline package (TSSOP)
What is SMD and BGA?
A ball grid array (BGA) is a type of surface-mount packaging. BGAs are used for integrated circuits, specifically for SMDs like microprocessors which require permanent mounting. Though it is a type of SMT, the ball grid array uses a different approach to connections.
What is dip in IC?
DIP, short for dual in-line package, is the most common through-hole IC package you’ll encounter. These little chips have two parallel rows of pins extending perpendicularly out of a rectangular, black, plastic housing. Aside from being used in breadboards, DIP ICs can also be soldered into PCBs.
What is difference between dip and PDIP?
DIP (Dual Inline Package) is an integrated circuit package with two rows of pins. PDIP (Plastic Dual Inline Package) is a DIP package with a molded plastic body.
What is the most commonly used integrated circuit packaging material?
Lead frames are the most common IC packages. You would use these packages for wire-bond interconnected dies, with a silver or gold-plated finish. For surface-mount plastic packages, manufacturers often use copper lead-frame materials.
What are the dimensions of a soic-8 case tape?
Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm
What are the dimensions of the soic-8 Vishay?
SOIC-8 Package Dimensions in Inches (mm) .036 (.91) .014 (.36) .170 (4.32) .045 (1.14) .260 (6.6) R .010 (.13) .050 (1.27) i178003
Is the SOIC / MSOP / TSSOP / dip evaluation board a blank PCB?
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout.
How are the pins on a dip footprint marked?
The pins of the DIP footprint are rotated 90° in relation to the pins of the SOIC. We covered the pin-1 markings for the SOIC in the assembly section. Pin 1 of the DIP footprint is marked two ways. First, the solder pad for pin 1 is square, while the others are round.