What is OSP surface finish?
OSP (Organic Solderability Preservative) OSP is a water-based, organic surface finish that is typically used for copper pads. It selectively bonds to copper and protects the copper pad before soldering. OSP is environmentally friendly, provides a coplanar surface, is lead-free, and requires low equipment maintenance.
What is OSP coating?
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. The compounds typically used are from the azole family such as benzotriazoles, imidazoles, benzimidazoles.
Is ENIG a RoHS?
ENIG PCB finish is a double layer metallic coating with nickel that acts both as a protective barrier to the copper circuits and a surface on which the components are welded. A layer of gold protects nickel during storage. Enig is Rohs compliant and people tend to use the tersm together.
Is ENIG same as immersion gold?
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
What is OSP made of?
OSP is the abbreviation of Organic Solderability Preservative that has earned great reputation in PCB industry. Usually, the components of OSP are alkylbenzimidazole, organic acid, cupric chloride and deionized water,etc.
What is Hal finish?
HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.
What is black pad?
Black pad is a term that usually refers to nickel corrosion on electroless nickel and gold immersion (ENIG) surface finishes on PCBs. The defect is not seen as part of normal QC procedures as the immersion gold masks the appearance of the nickel under the gold.
How is ENIG applied?
Che Ni/Au or ENIG is a chemical process, applied after solder mask that adds 3-6µm Nickel before adding between 0.065µm and 0.10µm Gold onto the copper.
What is copper OSP?
In simple terms, OSP is a chemical process to grow a layer of organic coating on the clean bare copper surface, which has anti-oxidation, heat shock and moisture resistance, to protect the copper surface from rust (oxidation or vulcanization, etc.) in normal environment.
What is HASL PCB finish?
What is HASL lead free finish?
HASL / Lead Free HASL HASL is the predominant surface finish used in the industry. The process consists of immersing circuit boards in a molten pot of a tin/lead alloy and then removing the excess solder by using ‘air knives’, which blow hot air across the surface of the board.
What does OSP stand for in copper foil?
OSP is a process for the surface treatment of printed circuit board (PCB) copper foil in accordance with the requirements of RoHS. OSP is the abbreviation of Organic Solderability Preservatives.
What does OSP mean on a PCB surface?
OSP is thin organic coating on the surface of PCB, if a long time exposure to high temperature and high humidity environment, the occurrence of PCB surface oxidation, weldability variation, after reflow soldering process, organic coating on PCB surface will be thinner, resulting in PCB easily oxidized copper foil.
Which is the best OSP for copper and gold?
Glicoat-SMD F2(LX) is de fact standard OSP to give excellent solder paste spreadability as well as solder flow-up in conjunction with lead-free solder. No OSP deposition on gold surface only on copper, it is suitable for copper and gold mixed selective gold PWBs.
How is OSP PCB packed in a vacuum?
OSP PCB shall be packed in vacuum with a desiccant and humidity display card attached. Transport and storage of PCB with OSP shall be made using isolation paper to prevent friction from damaging the OSP surface.